Thermal conditioning unit, lithographic apparatus and device manufacturing method

ABSTRACT

A thermal conditioning unit to thermally condition a substrate in a lithographic apparatus, the thermal conditioning unit including: a thermal conditioning element having a first layer, in use, facing the substrate and including a material having a thermal conductivity of 100 W/mK or more, a second layer and a heat transfer component positioned between the first and second layers; and a stiffening member which is stiffer than the thermal conditioning element and configured to support the thermal conditioning element so as to reduce mechanical deformation thereof, wherein the thermal conditioning element is thermally isolated from the stiffening member.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/395,461, filed Oct. 14, 2014, which is the U.S. national phase entryof PCT patent application no. PCT/EP2013/057867, which was filed on Apr.16, 2013, which claims the benefit of priority of U.S. provisionalapplication No. 61/648,452, which was filed on May 17, 2012, and U.S.provisional application No. 61/737,002, which was filed on Dec. 13,2012, each of which is incorporated herein in its entirety by reference.

FIELD

The present invention relates to a thermal conditioning unit, alithographic apparatus and a device manufacturing method.

BACKGROUND

A lithographic apparatus is a machine that applies a desired patternonto a substrate, usually onto a target portion of the substrate. Alithographic apparatus can be used, for example, in the manufacture ofintegrated circuits (ICs). In that instance, a patterning device, whichis alternatively referred to as a mask or a reticle, may be used togenerate a circuit pattern to be formed on an individual layer of theIC. This pattern can be transferred onto a target portion (e.g.comprising part of, one, or several dies) on a substrate (e.g. a siliconwafer). Transfer of the pattern is typically via imaging onto a layer ofradiation-sensitive material (resist) provided on the substrate. Ingeneral, a single substrate will contain a network of adjacent targetportions that are successively patterned. Known lithographic apparatusinclude so-called steppers, in which each target portion is irradiatedby exposing an entire pattern onto the target portion at one time, andso-called scanners, in which each target portion is irradiated byscanning the pattern through a radiation beam in a given direction (the“scanning”-direction) while synchronously scanning the substrateparallel or anti-parallel to this direction. It is also possible totransfer the pattern from the patterning device to the substrate byimprinting the pattern onto the substrate.

It has been proposed to immerse the substrate in the lithographicprojection apparatus in a liquid having a relatively high refractiveindex, e.g. water, so as to fill a space between the final element ofthe projection system and the substrate. In an embodiment, the liquid isdistilled water, although another liquid can be used. An embodiment ofthe present invention will be described with reference to liquid.However, another fluid may be suitable, particularly a wetting fluid, anincompressible fluid and/or a fluid with higher refractive index thanair, desirably a higher refractive index than water. Fluids excludinggases are particularly desirable. The point of this is to enable imagingof smaller features since the exposure radiation will have a shorterwavelength in the liquid. (The effect of the liquid may also be regardedas increasing the effective numerical aperture (NA) of the system andalso increasing the depth of focus.) Other immersion liquids have beenproposed, including water with solid particles (e.g. quartz) suspendedtherein, or a liquid with a nano-particle suspension (e.g. particleswith a maximum dimension of up to 10 nm). The suspended particles may ormay not have a similar or the same refractive index as the liquid inwhich they are suspended. Other liquids which may be suitable include ahydrocarbon, such as an aromatic, a fluorohydrocarbon, and/or an aqueoussolution.

SUMMARY

Before being positioned on a substrate table in a lithographic apparatusready for exposure or other operation, a substrate is generallytemperature conditioned. The aim is to place the substrate on thesubstrate table only when its temperature is within a desiredtemperature level and/or uniformity. If the temperature is not withinthe desired temperature level and/or uniformity, this can lead toimaging errors (for example overlay errors) and/or other difficulties.Additionally, if the desired temperature level and/or uniformity has notbeen achieved this can lead to thermal instability in the system.

A process substrate is delivered by a track where it is usuallytemperature conditioned on a chill plate before being loaded onto atemperature stabilization unit which may be part of the track, asubstrate handler and/or the lithographic apparatus. At the temperaturestabilization unit the substrate is conditioned to have the desiredtemperature level and/or uniformity. Additionally pre-alignment of thesubstrate may take place. Thereafter the substrate is loaded onto thesubstrate table by the substrate handler in the lithographic apparatus.

A dummy substrate may be loaded onto a substrate table in thelithographic apparatus. For example, a dummy substrate may be usedduring pre-conditioning of the substrate table and/or during acalibration process. The purpose of the dummy substrate is that it takesthe place of a normal substrate so that the machine behaves normally asif a substrate were on the substrate table. A dummy substrate may not bedelivered via the track and may not be conditioned on a chill plate. Adummy substrate may be stored in a holding location in the apparatus.Therefore, a dummy substrate may be loaded directly onto the temperaturestabilization unit. A dummy substrate may therefore have a largertemperature off-set from the desired temperature level and/or uniformityit is first placed on the temperature stabilization unit than a processsubstrate.

A lithographic apparatus may allow a substrate to be loaded from asource other than a track or a holding location in the apparatus andsuch a substrate is typically not conditioned on a chill plate but isloaded directly onto the temperature stabilization unit. Such asubstrate may also vary from the desired temperature level and/oruniformity more than a process substrate from the track.

A difficulty is that a dummy substrate and/or a substrate not loadedfrom the track may require a longer residence time on the temperaturestabilization unit in order to achieve the desired temperature leveland/or uniformity. This leads to a loss in throughput because of thelonger waiting time of the substrate on the temperature stabilizationunit. Additionally, the temperature of the temperature stabilizationunit itself may not recover quickly enough before the first processsubstrate from the track is placed on the temperature stabilization unitafter a dummy substrate or a substrate which has not been processedalong the track. This can lead to an increased temperature off-set ofboth the temperature stabilization unit and the substrate temperaturefor the first few process substrate after the dummy substrate orsubstrate not loaded from the track. The increased temperature off-setmay lead to an overlay error on the process substrate.

Additionally, the temperature recovery time of a temperaturestabilization unit is desirably as low as possible to increasethroughput of substrates through the apparatus.

It is desirable, for example, to provide a thermal conditioning unitwhich can quickly condition the temperature level and/or uniformity of asubstrate and/or recover temperature level and/or uniformity itselfquickly between substrates.

According to an aspect of the invention, there is provided a thermalconditioning unit to thermally condition a substrate in a lithographicapparatus, the thermal conditioning unit comprising: a thermalconditioning element comprising a first layer, in use, facing thesubstrate and comprising a material having a thermal conductivity of 100W/mK or more, a second layer and a heat transfer component positionedbetween the first and second layers; and a stiffening member which isstiffer than the thermal conditioning element and configured to supportthe thermal conditioning element so as to reduce mechanical deformationthereof, wherein the thermal conditioning element is thermally isolatedfrom the stiffening member.

According to an aspect of the present invention, there is provided adevice manufacturing method using a lithographic apparatus, the methodcomprising: thermally conditioning a substrate by placing it over athermal conditioning element comprising a first layer, facing thesubstrate, comprising a material having a thermal conductivity of 100W/mK or more, a second layer and a heat transfer component positionedbetween the first and second layers, the thermal conditioning elementbeing supported by a stiffening member to reduce mechanical deformationof the thermal conditioning element; and projecting a patterned beamonto the substrate, wherein the thermal conditioning element isthermally isolated from the stiffening member.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described, by way of exampleonly, with reference to the accompanying schematic drawings in whichcorresponding reference symbols indicate corresponding parts, and inwhich:

FIG. 1 depicts a lithographic apparatus according to an embodiment ofthe invention;

FIGS. 2 and 3 depict a liquid supply system for use in a lithographicprojection apparatus;

FIG. 4 depicts a further liquid supply system for use in a lithographicprojection apparatus;

FIG. 5 depicts, in cross-section, a barrier member which may be used inan embodiment of the present invention as an immersion liquid supplysystem;

FIG. 6 depicts a lithographic apparatus according to an embodiment ofthe invention;

FIG. 7 is a more detailed view of the apparatus 4100;

FIG. 8 is a more detailed view of the source collector apparatus SO ofthe apparatus of FIGS. 6 and 7;

FIG. 9 is a graph of temperature on the y axis versus time on the x axisfor a plurality of positions on a temperature stabilization unit;

FIG. 10 is a graph of temperature off-set of a substrate on the y axisversus layer thickness on the x axis;

FIG. 11 illustrates, in cross-section, a thermal conditioning unitaccording to an embodiment of the present invention;

FIG. 12 illustrates, in cross-section, a thermal conditioning unitaccording to an embodiment of the present invention;

FIG. 13 illustrates, in plan, a thermal conditioning unit according toan embodiment of the present invention;

FIG. 14 is a graph of thickness of an aluminum thermal conditioningelement on the y axis versus heat transfer coefficient to water alongthe x axis with the different lines representing different temperaturelevels of the substrate after a certain waiting time on the thermalconditioning element when loaded with an initial offset;

FIG. 15 is the same as FIG. 14 except for a stainless steel rather thanaluminum thermal conditioning element;

FIG. 16 is a graph of the width of a cooling channel on the y axisversus the height of a cooling channel on the x axis for a spiralchannel in an aluminum thermal conditioning element with the differentlines representing different constant heat transfer coefficients orpressure drops; and

FIG. 17 is the same graph as FIG. 9 except for a thermal conditioningunit according to an embodiment of the present invention.

DETAILED DESCRIPTION

FIG. 1 schematically depicts a lithographic apparatus according to oneembodiment of the invention. The apparatus comprises:

-   -   an illumination system (illuminator) IL configured to condition        a radiation beam B (e.g. UV radiation, DUV radiation or EUV        radiation);    -   a support structure (e.g. a mask table) MT constructed to        support a patterning device (e.g. a mask) MA and connected to a        first positioner PM configured to accurately position the        patterning device in accordance with certain parameters;    -   a substrate table (e.g. a wafer table) WT constructed to hold a        substrate (e.g. a resist-coated wafer) W and connected to a        second positioner PW configured to accurately position the        substrate in accordance with certain parameters; and    -   a projection system (e.g. a refractive projection lens system)        PS configured to project a pattern imparted to the radiation        beam B by patterning device MA onto a target portion C (e.g.        comprising one or more dies) of the substrate W.

The illumination system may include various types of optical components,such as refractive, reflective, magnetic, electromagnetic, electrostaticor other types of optical components, or any combination thereof, fordirecting, shaping, or controlling radiation.

The support structure MT holds the patterning device. The supportstructure MT holds the patterning device in a manner that depends on theorientation of the patterning device, the design of the lithographicapparatus, and other conditions, such as for example whether or not thepatterning device is held in a vacuum environment. The support structureMT can use mechanical, vacuum, electrostatic or other clampingtechniques to hold the patterning device. The support structure MT maybe a frame or a table, for example, which may be fixed or movable asrequired. The support structure MT may ensure that the patterning deviceis at a desired position, for example with respect to the projectionsystem. Any use of the terms “reticle” or “mask” herein may beconsidered synonymous with the more general term “patterning device”.

The term “patterning device” used herein should be broadly interpretedas referring to any device that can be used to impart a radiation beamwith a pattern in its cross-section such as to create a pattern in atarget portion of the substrate. It should be noted that the patternimparted to the radiation beam may not exactly correspond to the desiredpattern in the target portion of the substrate, for example if thepattern includes phase-shifting features or so called assist features.Generally, the pattern imparted to the radiation beam will correspond toa particular functional layer in a device being created in the targetportion, such as an integrated circuit.

The patterning device may be transmissive or reflective. Examples ofpatterning devices include masks, programmable mirror arrays, andprogrammable LCD panels. Masks are well known in lithography, andinclude mask types such as binary, alternating phase-shift, andattenuated phase-shift, as well as various hybrid mask types. An exampleof a programmable mirror array employs a matrix arrangement of smallmirrors, each of which can be individually tilted so as to reflect anincoming radiation beam in different directions. The tilted mirrorsimpart a pattern in a radiation beam which is reflected by the mirrormatrix.

The terms “projection system” used herein should be broadly interpretedas encompassing any type of system, including refractive, reflective,catadioptric, magnetic, electromagnetic and electrostatic opticalsystems, or any combination thereof, as appropriate for the exposureradiation being used, or for other factors such as the use of animmersion liquid or the use of a vacuum. Any use of the term “projectionlens” herein may be considered as synonymous with the more general term“projection system”.

As here depicted, the apparatus is of a transmissive type (e.g.employing a transmissive mask). Alternatively, the apparatus may be of areflective type (e.g. employing a programmable mirror array of a type asreferred to above, or employing a reflective mask).

The lithographic apparatus may be of a type having two or more substratesupport structures, such as substrate stages or substrate tables, and/ortwo or more support structures for patterning devices. In an apparatuswith multiple substrate stages, all the substrate stages can beequivalent and interchangeable. In an embodiment, at least one of themultiple substrate stages is particularly adapted for exposure steps andat least one of the multiple substrate stages is particularly adaptedfor measurement or preparatory steps. In an embodiment of the inventionone or more of the multiple substrate stages is replaced by ameasurement stage. A measurement stage includes at least part one ormore sensor systems such as a sensor detector and/or target of thesensor system but does not support a substrate. The measurement stage ispositionable in the projection beam in place of a substrate stage or asupport structure for a patterning device. In such apparatus theadditional stages may be used in parallel, or preparatory steps may becarried out on one or more stages while one or more other stages arebeing used for exposure.

Referring to FIG. 1, the illuminator IL receives a radiation beam from aradiation source SO. The source and the lithographic apparatus may beseparate entities, for example when the source is an excimer laser. Insuch cases, the source is not considered to form part of thelithographic apparatus and the radiation beam is passed from the sourceSO to the illuminator IL with the aid of a beam delivery system BDcomprising, for example, suitable directing mirrors and/or a beamexpander. In other cases the source may be an integral part of thelithographic apparatus, for example when the source is a mercury lamp.The source SO and the illuminator IL, together with the beam deliverysystem BD if required, may be referred to as a radiation system.

The illuminator IL may comprise an adjuster AM configured to adjust theangular intensity distribution of the radiation beam. Generally, atleast the outer and/or inner radial extent (commonly referred to asσ-outer and σ-inner, respectively) of the intensity distribution in apupil plane of the illuminator can be adjusted. In addition, theilluminator IL may comprise various other components, such as anintegrator IN and a condenser CO. The illuminator may be used tocondition the radiation beam, to have a desired uniformity and intensitydistribution in its cross-section. Similar to the source SO, theilluminator IL may or may not be considered to form part of thelithographic apparatus. For example, the illuminator IL may be anintegral part of the lithographic apparatus or may be a separate entityfrom the lithographic apparatus. In the latter case, the lithographicapparatus may be configured to allow the illuminator IL to be mountedthereon. Optionally, the illuminator IL is detachable and may beseparately provided (for example, by the lithographic apparatusmanufacturer or another supplier).

The radiation beam B is incident on the patterning device (e.g., mask)MA, which is held on the support structure (e.g., mask table) MT, and ispatterned by the patterning device. Having traversed the patterningdevice MA, the radiation beam B passes through the projection system PS,which focuses the beam onto a target portion C of the substrate W.Substrate W is held on the substrate table WT by a substrate holderaccording to an embodiment of the present invention and describedfurther below. With the aid of the second positioner PW and positionsensor IF (e.g. an interferometric device, linear encoder or capacitivesensor), the substrate table WT can be moved accurately, e.g. so as toposition different target portions C in the path of the radiation beamB. Similarly, the first positioner PM and another position sensor (whichis not explicitly depicted in FIG. 1) can be used to accurately positionthe patterning device MA with respect to the path of the radiation beamB, e.g. after mechanical retrieval from a mask library, or during ascan. In general, movement of the support structure MT may be realizedwith the aid of a long-stroke module (coarse positioning) and ashort-stroke module (fine positioning), which form part of the firstpositioner PM. Similarly, movement of the substrate table WT may berealized using a long-stroke module and a short-stroke module, whichform part of the second positioner PW. In the case of a stepper (asopposed to a scanner) the support structure MT may be connected to ashort-stroke actuator only, or may be fixed. Patterning device MA andsubstrate W may be aligned using patterning device alignment marks M1,M2 and substrate alignment marks P1, P2. Although the substratealignment marks as illustrated occupy dedicated target portions, theymay be located in spaces between target portions (these are known asscribe-lane alignment marks). Similarly, in situations in which morethan one die is provided on the patterning device MA, the patterningdevice alignment marks may be located between the dies.

The depicted apparatus could be used in at least one of the followingmodes:

1. In step mode, the support structure MT and the substrate table WT arekept essentially stationary, while an entire pattern imparted to theradiation beam is projected onto a target portion C at one time (i.e. asingle static exposure). The substrate table WT is then shifted in the Xand/or Y direction so that a different target portion C can be exposed.In step mode, the maximum size of the exposure field limits the size ofthe target portion C imaged in a single static exposure.

2. In scan mode, the support structure MT and the substrate table WT arescanned synchronously while a pattern imparted to the radiation beam isprojected onto a target portion C (i.e. a single dynamic exposure). Thevelocity and direction of the substrate table WT relative to the supportstructure MT may be determined by the (de-)magnification and imagereversal characteristics of the projection system PS. In scan mode, themaximum size of the exposure field limits the width (in the non-scanningdirection) of the target portion in a single dynamic exposure, whereasthe length of the scanning motion determines the height (in the scanningdirection) of the target portion.

3. In another mode, the support structure MT is kept essentiallystationary holding a programmable patterning device, and the substratetable WT is moved or scanned while a pattern imparted to the radiationbeam is projected onto a target portion C. In this mode, generally apulsed radiation source is employed and the programmable patterningdevice is updated as required after each movement of the substrate tableWT or in between successive radiation pulses during a scan. This mode ofoperation can be readily applied to maskless lithography that utilizesprogrammable patterning device, such as a programmable mirror array of atype as referred to above.

Combinations and/or variations on the above described modes of use orentirely different modes of use may also be employed.

Arrangements for providing liquid between a final element of theprojection system PS and the substrate can be classed into three generalcategories. These are the bath type arrangement, the so-called localizedimmersion system and the all-wet immersion system. In a bath typearrangement substantially the whole of the substrate W and optionallypart of the substrate table WT is submersed in a bath of liquid.

A localized immersion system uses a liquid supply system in which liquidis only provided to a localized area of the substrate. The space filledby liquid is smaller in plan than the top surface of the substrate andthe volume filled with liquid remains substantially stationary relativeto the projection system PS while the substrate W moves underneath thatvolume. FIGS. 2-5 show different supply devices which can be used insuch a system. A sealing feature is present to seal liquid to thelocalized area. One way which has been proposed to arrange for this isdisclosed in PCT patent application publication no. WO 99/49504.

In an all wet arrangement the liquid is unconfined. The whole topsurface of the substrate and all or part of the substrate table iscovered in immersion liquid. The depth of the liquid covering at leastthe substrate is small. The liquid may be a film, such as a thin film,of liquid on the substrate. Immersion liquid may be supplied to or inthe region of a projection system and a facing surface facing theprojection system (such a facing surface may be the surface of asubstrate and/or a substrate table). Any of the liquid supply devices ofFIGS. 2-5 can also be used in such a system. However, a sealing featureis not present, not activated, not as efficient as normal or otherwiseineffective to seal liquid to only the localized area.

As illustrated in FIGS. 2 and 3, liquid is supplied by at least oneinlet onto the substrate, preferably along the direction of movement ofthe substrate relative to the final element. Liquid is removed by atleast one outlet after having passed under the projection system. As thesubstrate is scanned beneath the element in a −X direction, liquid issupplied at the +X side of the element and taken up at the −X side.Various orientations and numbers of in- and outlets positioned aroundthe final element are possible; one example is illustrated in FIG. 3 inwhich four sets of an inlet with an outlet on either side are providedin a regular pattern around the final element. Note that the directionof flow of the liquid is shown by arrows in FIGS. 2 and 3.

A further immersion lithography solution with a localized liquid supplysystem is shown in FIG. 4. Liquid is supplied by two groove inlets oneither side of the projection system PS and is removed by a plurality ofdiscrete outlets arranged radially outwardly of the inlets. Note thatthe direction of flow of fluid and of the substrate is shown by arrowsin FIG. 4.

Another arrangement which has been proposed is to provide the liquidsupply system with a liquid confinement structure which extends along atleast a part of a boundary of the space between the final element of theprojection system and the substrate, substrate table or both. Such anarrangement is illustrated in FIG. 5.

FIG. 5 schematically depicts a localized liquid supply system or fluidhandling system with a liquid confinement structure 12, which extendsalong at least a part of a boundary of the space between the finalelement of the projection system and the substrate table WT or substrateW. (Please note that reference in the following text to surface of thesubstrate W also refers in addition or in the alternative to a surfaceof the substrate table, unless expressly stated otherwise.) In anembodiment, a seal is formed between the liquid confinement structure 12and the surface of the substrate W and which may be a contactless sealsuch as a gas seal (such a system with a gas seal is disclosed inEuropean patent application publication no. EP-A-1,420,298) or a liquidseal.

The liquid confinement structure 12 at least partly contains liquid inthe space 11 between a final element of the projection system PS and thesubstrate W. The space 11 is at least partly formed by the liquidconfinement structure 12 positioned below and surrounding the finalelement of the projection system PS. Liquid is brought into the spacebelow the projection system PS and within the liquid confinementstructure 12 by liquid inlet 13. The liquid may be removed by liquidoutlet 13.

The liquid may be contained in the space 11 by a gas seal 16 which,during use, is formed between the bottom of the barrier member 12 andthe surface of the substrate W. The gas in the gas seal is providedunder pressure via inlet 15 to the gap between barrier member 12 andsubstrate W. The gas is extracted via outlet 14. The overpressure on thegas inlet 15, vacuum level on the outlet 14 and geometry of the gap arearranged so that there is a high-velocity gas flow 16 inwardly thatconfines the liquid. The force of the gas on the liquid between thebarrier member 12 and the substrate W contains the liquid in a space 11.Such a system is disclosed in United States patent applicationpublication no. US 2004-0207824, which is hereby incorporated byreference in its entirety. In an embodiment, the liquid confinementstructure 12 does not have a gas seal.

An embodiment of the present invention may be applied to any fluidhandling structure including those disclosed, for example, in UnitedStates patent application publication nos. US 2006-0158627, US2006-0038968, US 2008-0212046, US 2009-0279060, US 2009-0279062, US2004-0207824, US 2010-0313974 and US 2012-0120376, the contents of allof which are hereby incorporated in their entirety by reference.

Many other types of liquid supply system are possible. An embodiment ofthe present invention is neither limited to any particular type ofliquid supply system, nor to immersion lithography. An embodiment of theinvention may be applied equally in any lithography. In an EUVlithography apparatus, the beam path is substantially evacuated andimmersion arrangements described above are not used.

A control system 500 shown in FIG. 1 controls the overall operations ofthe lithographic apparatus and in particular performs an optimizationprocess described further below. Control system 500 can be embodied as asuitably-programmed general purpose computer comprising a centralprocessing unit and volatile and non-volatile storage. Optionally, thecontrol system may further comprise one or more input and output devicessuch as a keyboard and screen, one or more network connections and/orone or more interfaces to the various parts of the lithographicapparatus. It will be appreciated that a one-to-one relationship betweencontrolling computer and lithographic apparatus is not necessary. In anembodiment of the invention one computer can control multiplelithographic apparatuses. In an embodiment of the invention, multiplenetworked computers can be used to control one lithographic apparatus.The control system 500 may also be configured to control one or moreassociated process devices and substrate handling devices in a lithocellor cluster of which the lithographic apparatus forms a part. The controlsystem 500 can also be configured to be subordinate to a supervisorycontrol system of a lithocell or cluster and/or an overall controlsystem of a fab.

FIG. 6 schematically depicts an EUV lithographic apparatus 4100including a source collector apparatus SO. The apparatus comprises:

-   -   an illumination system (illuminator) EIL configured to condition        a radiation beam B (e.g. EUV radiation);    -   a support structure (e.g. a mask table) MT constructed to        support a patterning device (e.g. a mask or a reticle) MA and        connected to a first positioner PM configured to accurately        position the patterning device;    -   a substrate table (e.g. a wafer table) WT constructed to hold a        substrate (e.g. a resist-coated wafer) W and connected to a        second positioner PW configured to accurately position the        substrate; and    -   a projection system (e.g. a reflective projection system) PS        configured to project a pattern imparted to the radiation beam B        by patterning device MA onto a target portion C (e.g. comprising        one or more dies) of the substrate W.

These basic components of the EUV lithographic apparatus are similar infunction to the corresponding components of the lithographic apparatusof FIG. 1. The description below mainly covers areas of difference andduplicative description of aspects of the components that are the sameis omitted.

In an EUV lithographic apparatus, it is desirable to use a vacuum or lowpressure environment since gases can absorb too much radiation. A vacuumenvironment can therefore be provided to the whole beam path with theaid of a vacuum wall and one or more vacuum pumps.

Referring to FIG. 6, the EUV illuminator EIL receives an extreme ultraviolet radiation beam from the source collector apparatus SO. Methods toproduce EUV radiation include, but are not necessarily limited to,converting a material into a plasma state that has at least one element,e.g., xenon, lithium or tin, with one or more emission lines in the EUVrange.

The radiation beam EB is incident on the patterning device (e.g., mask)MA, which is held on the support structure (e.g., mask table) MT, and ispatterned by the patterning device. After being reflected from thepatterning device (e.g. mask) MA, the radiation beam EB passes throughthe projection system PS, which focuses the beam onto a target portion Cof the substrate W. With the aid of the second positioner PW andposition sensor PS2 (e.g. an interferometric device, linear encoder orcapacitive sensor), the substrate table WT can be moved accurately, e.g.so as to position different target portions C in the path of theradiation beam EB. Similarly, the first positioner PM and anotherposition sensor PS1 can be used to accurately position the patterningdevice (e.g. mask) MA with respect to the path of the radiation beam EB.Patterning device (e.g. mask) MA and substrate W may be aligned usingmask alignment marks M1, M2 and substrate alignment marks P1, P2.

The depicted apparatus could be used the same modes as the apparatus ofFIG. 1.

FIG. 7 shows the EUV apparatus 4100 in more detail, including the sourcecollector apparatus SO, the EUV illumination system EIL, and theprojection system PS. The source collector apparatus SO is constructedand arranged such that a vacuum environment can be maintained in anenclosing structure 4220 of the source collector apparatus SO. An EUVradiation emitting plasma 4210 may be formed by a discharge producedplasma source. EUV radiation may be produced by a gas or vapor, forexample Xe gas, Li vapor or Sn vapor in which the plasma 4210 is createdto emit radiation in the EUV range of the electromagnetic spectrum.

The radiation emitted by the plasma 4210 is passed from a source chamber4211 into a collector chamber 4212 via an optional gas barrier and/orcontaminant trap 4230 (in some cases also referred to as contaminantbarrier or foil trap) which is positioned in or behind an opening insource chamber 4211.

The collector chamber 4212 may include a radiation collector CO whichmay be a so-called grazing incidence collector. Radiation collector COhas an upstream radiation collector side 4251 and a downstream radiationcollector side 4252. Radiation that traverses collector CO can bereflected by a grating spectral filter 4240 to be focused in a virtualsource point IF. The virtual source point IF is commonly referred to asthe intermediate focus, and the source collector apparatus is arrangedsuch that the intermediate focus IF is located at or near an opening4221 in the enclosing structure 4220. The virtual source point IF is animage of the radiation emitting plasma 4210.

Subsequently the radiation traverses the illumination system IL, whichmay include a facetted field mirror device 422 and a facetted pupilmirror device 424 arranged to provide a desired angular distribution ofthe radiation beam 421, at the patterning device MA, as well as adesired uniformity of radiation intensity at the patterning device MA.Upon reflection of the beam of radiation 421 at the patterning deviceMA, held by the support structure MT, a patterned beam 426 is formed andthe patterned beam 426 is imaged by the projection system PS viareflective elements 428, 430 onto a substrate W held by the substratestage or substrate table WT.

Collector optic CO, as illustrated in FIG. 7, is depicted as a nestedcollector with grazing incidence reflectors 4253, 4254 and 4255, just asan example of a collector (or collector mirror). The grazing incidencereflectors 4253, 4254 and 4255 are disposed axially symmetric around anoptical axis O and a collector optic CO of this type is preferably usedin combination with a discharge produced plasma source, often called aDPP source.

Alternatively, the source collector apparatus SO may be part of an LPPradiation system as shown in FIG. 8. A laser LA is arranged to depositlaser energy into a fuel, such as xenon (Xe), tin (Sn) or lithium (Li),creating the highly ionized plasma 4210 with electron temperatures ofseveral 10's of eV. The energetic radiation generated duringde-excitation and recombination of these ions is emitted from theplasma, collected by a near normal incidence collector optic CO andfocused onto the opening 4221 in the enclosing structure 4220.

An embodiment of the present invention can be applied to any type oflithographic apparatus.

A temperature stabilization unit comprises a thermal conditioning unitwhich includes a stiffening member and a thermal conditioning element tothermally condition the substrate and to support the substrate.Simulations were carried out for a thermal conditioning element (20 mmthick and of aluminum, assuming a heat transfer rate of 700 W/m²K). FIG.9 shows temperature variation along the y axis occurring over time onthe x axis for a thermal conditioning element. The temperature off-setfrom the starting temperature for a plurality of different locations andfor thermal conditioning fluid (water) used in the thermal conditioningelement is plotted. A number of substrates are placed on the thermalconditioning element at a temperature above the original temperature ofthe thermal conditioning unit. Substrates are placed on the thermalconditioning element approximately every nine seconds and left on thethermal conditioning element for six seconds. It can be seen that overtime the temperature of the thermal conditioning element rises eventhough the thermal conditioning element has three seconds betweensubstrates to recover. As a result, the temperature at which a substrateleaves the thermal conditioning element changes over time (for the topof the substrate (long dashes separated by single dots) the firstsubstrate leaves with a temperature off-set of about 8, the second witha temperature off-set of about 11, the third with a temperature off-setof about 12, the fourth with a temperature off-set of about 13 and thefifth with a temperature off-set of about 14). This variation intemperature off-set is disadvantageous because it means that when such asubstrate is positioned onto the substrate table of the lithographicapparatus, it does so at a different temperature than another substratewhich can result in errors, as described above.

This difficulty results from the high heat capacity of the thermalconditioning element of the thermal conditioning unit. In a typicalthermal conditioning unit, the thermal conditioning element typicallyhas a thickness of about 20 mm and is made from aluminum. A heattransfer rate through such a thermal conditioning element (usingthermally conditioned fluid passing through channels in the thermalconditioning element) of 700 W/m² K is assumed for producing the resultsof FIG. 9. An embodiment of the present invention as described below,assuming the same heat transfer rate, can result in the second andsubsequent substrates leaving the thermal conditioning element atsubstantially the same temperature (as illustrated in FIG. 17 which isthe result of the same simulation as FIG. 9 except with a thermalconditioning unit of an embodiment of the present invention).

FIG. 10 shows the results of a simulation in which an aluminum layer isbetween a substrate and a thermal conditioning element and a heattransfer rate of 500 W/m²K to the thermal conditioning element isassumed. The substrate is assumed to have an initial temperature off-setof 0.5 K from a desired set point. In the simulated results the aluminumlayer thickness is varied (along the x axis) and the temperature off-setfrom the desired set point of the substrate after 6 seconds is plottedin mK on the y axis. As can be seen, the temperature off-set after 6seconds decreases with decreasing thickness of aluminum layer.

The thermal capacity of the thermal conditioning element may beadvantageously reduced by reducing its thickness as shown by FIG. 10.However, this can result in deformation of the thermal conditioningelement. Such deformation results in uneven heat transfer between thethermal conditioning element and the substrate (which is supported bythe thermal conditioning element). Therefore, a separate supportstructure for the thermal conditioning element is used to reducemechanical deformation of the thermal conditioning element. Embodimentsof the present invention decouple the mechanical support function of thethermal conditioning unit from the thermal conditioning function. Thatis, the mechanical support and thermal conditioning functions areseparated. The thermal conditioning element supports the substrate.However, the thermal conditioning element itself might not have enoughstiffness to be able to do so. This is because the thermal conditioningelement is reduced in thickness to reduce the heat capacity. Therefore asupport is used to support the thermal conditioning element. In anembodiment the thermal conditioning element does not have enoughstiffness to support the substrate, but the stiffness is provideddirectly or indirectly by a stiffening member provided under the thermalconditioning element.

In an embodiment a stiffening member is provided. The stiffening memberis stiffer than the thermal conditioning element and configured tosupport the thermal conditioning element (for example via a support).This reduces mechanical deformation of the thermal conditioning element.

In an embodiment the thermal conditioning element is thermally isolatedfrom the remainder of the thermal conditioning unit (for example thestiffening member) and/or the environment. This helps prevent thethermal mass of the remainder of the thermal conditioning unit (e.g. thestiffening member) from adding to the thermal mass of the thermalconditioning element, thereby helping to ensure that the thermalresponse of the thermal conditioning element remains fast.

An embodiment of the present invention is illustrated in FIG. 11. FIG.11 illustrates a thermal conditioning unit 100 which may be atemperature stabilization unit. The thermal conditioning unit 100 may bepositioned in a lithographic apparatus, in a track of a fab, or in asubstrate handler.

The thermal conditioning unit 100 comprises a stiffening member 110, athermal conditioning element 200 and a support 300. The substrate W ispositioned above the thermal conditioning element 200.

The thermal conditioning element 200 has a thickness 205 reducedcompared to a typical thermal conditioning element. The reduction inthickness 205 directly results in a lower thermal mass of the thermalconditioning element 200. As a result the temperature stability of thethermal conditioning element 200 is improved; for the same heat transferrate a lower temperature variation between a sequence of substrates willbe present with a thinner thermal conditioning element 200 than for athicker thermal conditioning element 200 made of the same material (asis shown by comparing FIGS. 9 and 17).

The thermal conditioning element is supported on the stiffening member110, for example by a support 300. This reduces mechanical deformationof the thermal conditioning element 200 and in particular the flatnessof its top surface. Deformation might otherwise occur because of therelative thinness of the thermal conditioning element 200 (in anembodiment it is not self-supporting in that it deforms (e.g. bends)under self-weight). In an embodiment, the support 300 is relativelystiff in the z direction (the vertical direction) compared to in the xyplane in which the support 300 may be relatively compliant. This helpsto ensure that the top surface of the thermal conditioning element 200is flat which is a desirable feature. This is desirable to help ensureuniform heat transfer between the substrate W and the thermalconditioning element 200, in plan and/or to be able to minimize the sizeof the gap between the thermal conditioning element 200 and thesubstrate W (because a flat top surface provides more uniform thermalcoupling than an uneven surface (i.e. bends) resulting in a non-uniformgap) and so maximize heat transfer between the substrate and the thermalconditioning element 200. The gap between the substrate W and thethermal conditioning element 200 is desirably less than or equal to 50μm, less than or equal to 25 μm, or less than or equal to 15 μm, forexample 10 μm. The gap is desirably small because the film of gasbetween the substrate and thermal conditioning element 200 is a dominantresistance to heat transfer.

In an embodiment the support 300 is separate from the thermalconditioning element 200 and/or stiffening member 110. In an embodimentthe support 300 is part of the thermal conditioning element 200 and/orthe stiffening member 110.

In an embodiment as illustrated in FIG. 11, the thermal conditioningelement 200 at least partly holds or supports the substrate W. A gasbearing 245 is used to support the substrate W for which purpose gasoutlets 240 and inlets 250 are provided in the top surface of thethermal conditioning element 200. The gas inlets and outlets 240, 250may be connected to passageways that extend all the way through thethickness 205 of the thermal conditioning element 200, so that the gasis provided and extracted from beneath the thermal conditioning element200. The resulting gas flow past a portion of the underside of thesubstrate W acts as a gas bearing.

In an embodiment, additional or alternative structure to support thesubstrate W is provided. In the embodiment of FIG. 11 a substrateposition manipulator 350 is provided which contacts the substrate Wsubstantially at its center. The substrate W is partly supported by thesubstrate position manipulator 350 and partly by the gas bearing 245.The substrate position manipulator 350 extends through a throughhole inthe thermal conditioning element 200. The substrate position manipulator350 can be used to rotate the substrate W and can be used duringpre-alignment of the substrate while the substrate W is on the thermalconditioning unit 100. The substrate position manipulator 350 isoptional in this and every other embodiment.

In an embodiment the thermal conditioning element 200 is thermallyisolated from the stiffening member 110. The thermal isolation may beprovided by the support 300 or, as described below, by a lower layer ofthe thermal conditioning element 200. Thermally isolating the thermalconditioning element 200 from the stiffening member 110 (and/or theremainder of the thermal conditioning unit 100 and/or the surroundingatmosphere) helps ensure that the thermal mass of the stiffening member110, remainder of the thermal conditioning unit 100 and/or environmentis not added to the thermal mass of the thermal conditioning element200. This results in the thermal response of the thermal conditioningelement remaining high.

In the embodiment of FIG. 11 the support 300 comprises a supportstructure of a plurality of leaf springs 310. The leaf springs 310contact the thermal conditioning element 200 at a plurality of discretelocations. At least some of the plurality of discrete locations arepositioned distant from an edge of the thermal conditioning element 200.This helps ensure that sagging of the thermal conditioning element 200away from its edge is reduced or minimized. Additionally, the leafsprings 310 thermally insulate or isolate the thermal conditioningelement 200 from the remainder of the thermal conditioning unit 100 suchas the stiffening member 110, by providing a gap (e.g. filled with gasor a vacuum) between the thermal conditioning element 200 and stiffeningmember 110. This means that the remainder of the thermal conditioningunit 100 does not add to the thermal mass of the thermal conditioningelement 200. That would be undesirable as it would increase the thermalresponse time of the thermal conditioning element 200. In an embodimentthe leaf springs 310 thermally insulate or isolate the thermalconditioning element 200 from the surrounding environment. In anembodiment the leaf springs may comprise a material with a lowcoefficient of thermal conduction (e.g. stainless steel rather thancarbon steel or a polymer) meaning that the thermal conditioning element200 is also substantially thermally insulated or isolated from thestiffening member 110. The thermal conditioning element 200 may bethermally connected, to some extent, to other parts of the thermalconditioning unit 100, for example by tubing for fluid connected to thethermal conditioning element 200.

In an embodiment the thermal conditioning element 200 comprises a heattransfer component. In an embodiment the heat transfer componentcomprises at least one channel 230 for the passage therethrough of aheat transfer fluid. In an embodiment the heat transfer fluid is athermally conditioned fluid. In an embodiment the thermally conditionedfluid may be the same as a thermally conditioned fluid used for coolingone or more lenses of a lithographic apparatus. In an embodiment thethermally conditioned fluid is a liquid, for example water.

In an embodiment, in order to increase the heat transfer coefficient asmuch as possible, at least two channels 230 are provided in the thermalconditioning element 200. The at least two channels are supplied withheat transfer fluid in parallel. This has an advantage of not onlyincreasing or maximizing the total flow rate of fluid through thethermal conditioning element 200, but also reducing or minimizing thepressure drop of thermal conditioning fluid as it flows through thethermal conditioning element 200 and of reducing or minimizing thechange in temperature of the heat transfer fluid as it flows through thethermal conditioning element 200.

In an embodiment the at least one channel 230 may form part of a phasechange fluid heat transfer system. In such a system the heat transferfluid is chosen such that it changes phase at a desired set pointtemperature and is therefore capable of transferring heat much moreefficiently than a heat transfer fluid which does not change phase.

In an embodiment the channel 230 is part of a heat pipe. In a heat pipeat one end of the channel the heat transfer fluid is a liquid and at theother end of the channel the heat transfer fluid is a mixture of gas andliquid. Changing from a gas to a fluid, and vice versa, absorbs and letsout heat and so this is an efficient way of transferring heat betweenone end of the channel and the other. For this purpose a heat exchangermay be provided connected to the channel 230, optionally at a locationdistant from the thermal conditioning element 200. In case of twoparallel channels, a restriction can be placed upstream of the inlet ofthe individual channels to level the operational pressures of theliquid/gas mixtures inside the parallel channels, in order to level thetemperature levels in both parallel channels.

In an embodiment the thermal conditioning element 200 is comprised of asingle layer.

In an embodiment the thermal conditioning element 200 is comprised of anupper layer 210 and a lower layer 220 between which the heat transfercomponent is positioned. The upper and lower layers 210, 220 may beplates.

In an embodiment the upper layer 210 is formed of a material with a highthermal conductivity and a low heat capacity. This helps ensure thatheat is transferred quickly between the thermal conditioning element 200and the substrate W without much of the heat being absorbed by thethermal conditioning element 200 itself. In an embodiment the upperlayer 210 is made of a material with a heat capacity below about 3.0Jcm⁻³ K⁻¹ and a thermal conductivity above about 100 W/mK. An examplematerial is aluminum which has a thermal conductivity at 25° C. of 250W/mK and a heat capacity of 2.4 Jcm⁻³ K⁻¹. In an embodiment the upperlayer is made of magnesium which has a thermal conductivity of 156 W/mKand a heat capacity of 1.77 Jcm⁻³ K⁻¹. Other materials may be suitable,particularly a ceramic. Other examples include SiSiC which has a thermalconductivity 185 of W/mK and a heat capacity of 2.0 Jcm⁻³ K⁻¹ and(encapsulated) thermal pyrolytic graphite with a thermal conductivity of1500 W/mK and a heat capacity of 1.6 Jcm⁻³ K⁻¹.

In an embodiment the thickness of the upper layer 210 is less than orequal to 5 mm, less than or equal to 4 mm, less than or equal to 3 mm,less than or equal to 2 mm, less than or equal to 1.5 mm or less than orequal to 1 mm. In an embodiment the thickness of the upper layer is 1mm. As described below with reference to FIGS. 14-17, this alsoadvantageously reduces the heat capacity of the thermal conditioningelement 200, at the expense of stiffness. However, the reduction instiffness is compensated by providing the stiffening member 110.

In an embodiment the total thickness of the thermal conditioning element200 is less than or equal to 11 mm, less than or equal to 10 mm, lessthan or equal to 5 mm, or less than or equal to 3 mm.

In an embodiment the thickness of the lower layer 220 is less than orequal to 5 mm, less than or equal to 4 mm, less than or equal to 3 mm,less than or equal to 2 mm, less than or equal to 1.5 mm or less than orequal to 1 mm. In an embodiment the thickness of the lower layer is 1mm.

The lower layer 220 desirably has a low heat capacity. However, thethermal conductivity of the lower layer 220 is less important than thatof the upper layer 210. This is because the lower layer 220 does notprovide for heat transfer between the substrate W and the thermalconditioning element 200. Indeed, it may be advantageous that thethermal conductivity of the lower layer 220 is particularly low, forexample below about 50 W/mK, in order that heat does not transfer fromthe thermal conditioning element 200 to the support 300 and/orstiffening member 110. Leaking of heat into the support 300 orstiffening member 110 would be disadvantageous as the thermal mass ofthose components might result in the accumulation of heat illustrated inFIG. 9.

In an embodiment the lower layer 220 is made of aluminum, ceramic ormagnesium. In an embodiment the lower layer 220 is made of a highlyporous solid such as an aerogel. An aerogel is a solid (made from a gel)with an extremely low density and thermal conductivity (because it ismainly air). Other examples include Zerodur™ which is a glass ceramic (alithium aluminosilicate glass ceramic) with a thermal conductivity of1.4 W/mK and a heat capacity 2.0 Jcm⁻³ K⁻¹ or stainless steel with athermal conductivity of 15 W/mK and a heat capacity 4.0 Jcm⁻³ K⁻¹.

In an embodiment, the support 300 and/or stiffening member 110 is partof the thermal conditioning element 200. In an embodiment the lowerlayer 220 is configured as the support 300 and/or stiffening member 110.That is, the lower layer 200 is made stiff enough such that it reducesmechanical deformation of the upper layer 210. In an embodiment aseparate stiffening member 110 is not necessary. In an embodiment thelower layer 220 is made of a material with a low thermal conductivityand high stiffness. Desirably the lower layer 220 is made of a materialwith a low heat capacity such as an aerogel.

In an embodiment the support 300 may be an additional layer of thethermal conditioning element 200 (a layer between the lower layer 220and the stiffening member 110). In an additional or alternativeembodiment the additional layer is a layer of the stiffening member 110.In an additional or alternative embodiment the additional layer isphysically in contact with the lower layer 220 of the thermalconditioning element 200 and a top surface of the stiffening member 110.In an embodiment the additional layer is desirably a material with a lowthermal conductivity and/or low heat capacity and/or high stiffness.

In an embodiment the upper layer 210 and lower layer 220 are made ofdifferent materials. The upper layer 210 comprises a material with a lowheat capacity and a high thermal conductivity whereas the material ofthe lower layer 220 is a material with a low heat capacity andoptionally with a low thermal conductivity, for instance below about 50W/mK. The upper and lower layers 210, 220 can be joined in any wayincluding, but not limited to gluing, welding, brazing, or soldering(including glass frit bonding).

In an embodiment the upper and/or lower layer has a heat capacity ofless than or equal to 2.0 Jcm⁻³ K⁻¹ or less than or equal to 1.5 Jcm⁻³K⁻¹.

In an embodiment the stiffening member 110 is made of a material such asaluminum, steel, ceramic, glass ceramic or another material with a highstiffness. In an embodiment the stiffening member 110 is a unitary bodywhich may or may not be machined or formed with cavities and/orprojections in it. In an embodiment the stiffening member 110 maycomprise a plurality of components glued, welded, brazed, bolted orotherwise bonded or held together.

In an embodiment the distance between the bottom of the thermalconditioning element 200 and the top of the stiffening member 110 isgreater than the distance between the top of the thermal conditioningelement 200 and the bottom of the substrate W. This is advantageousbecause this results in better heat transfer between the substrate W andthe thermal conditioning element 200 compared to between the thermalconditioning element 200 and the stiffening member 110.

FIG. 12 illustrates an embodiment which is the same as that of FIG. 11except as described below. In the FIG. 12 embodiment the way that thethermal conditioning element 200 at least partly holds or supports thesubstrate W is different to that in FIG. 11 and the way in which thesupport 300 supports the thermal conditioning element 200 is differentto that in FIG. 11. In an embodiment instead of comprising the support300 of FIG. 12, the support of FIG. 11 may be used. In an embodimentinstead of comprising the projections 260 described below, theembodiment of FIG. 12 may comprise the gas bearing 245 of FIG. 11.

In FIG. 12 the thermal conditioning element 200 comprises one or moreprojections 260. The projection 260 (sometimes called a burl) has arelatively small total surface area but supports the substrate W on itsunderside in a plurality of locations. In an embodiment an underpressure may be provided between the projection 260 and the thermalconditioning element 200 and the substrate W. This would be effective toclamp the substrate W to the projection 260. The projection 260 may besimilar to the well known one or more projections used on a substratetable in a lithographic apparatus. The advantage of using a projection260 is that the heat transfer between the thermal conditioning element200 and substrate W is improved by the direct contact and resultingthermal conduction through the material of the upper layer 210 of thethermal conditioning element 200. In an embodiment a gas is provided(e.g. at an under pressure) to a region between the substrate W andthermal conditioning element 200, wherein the gas has a thermalconductivity greater than or equal to 100 mW/m·K at 298K. One such gasis H₂. Such a system is described in U.S. patent application U.S. Ser.No. 13/569,926 filed on Aug. 8, 2012, U.S. 61/521,952 filed on Aug. 10,2011 and U.S. 61/544,875 filed on Oct. 7, 2011, each of which is herebyincorporated in its entirety by reference.

In the embodiment of FIG. 12, the thermal conditioning element 200 issupported on the stiffening member 110 by a gas bearing 320. The gasbearing 320 reduces mechanical deformation of the thermal conditioningelement 200, particularly in the z direction.

In an embodiment a temperature sensor 375 is provided in the channel 230for heat transfer liquid. The signal from the temperature sensor 375 canbe used in a feedback manner such as in the way described in U.S. Ser.No. 13/183,220 filed on Jul. 14, 2011, hereby incorporated in itsentirety by reference. The temperature sensor 375 may be provided at theexit of a channel 230 (in which case the temperature measured is anintegral of the temperature along the length of the channel 230 and theresponse time is slow since liquid which is cooled by cold spots of thesubstrate has to travel a long distance along the channel) or aplurality of temperature sensors 375 may be provided along the length ofthe channel 230. In an embodiment the temperature sensor(s) 375 is/arealternatively or additionally arranged in the thermal conditioningelement 200.

In an embodiment, the thermal conditioning unit 100 of FIG. 12 does nothave a substrate position manipulator 350 and a separate pre-aligningunit is provided.

FIG. 13 illustrates an embodiment in which at least one heat transferelement (e.g. heater) 400 is provided on or in the thermal conditioningelement 200. The heat transfer element 400 may have any shape. In oneembodiment the heat transfer element is an annular ring. In anembodiment a plurality of heat transfer elements 400 are provided. In anembodiment a plurality of heat transfer elements 400 are in the form ofannular rings around the central axis of the thermal conditioningelement 200. The heat transfer elements 400 may be on the surface of theupper layer 210. In an embodiment the heat transfer elements 400 are inthe form of a thin film on the outer surface of the upper layer 210. Theheat transfer element 400 may be such as described in United Statespatent application publication no. US 2011-0222033, which is herebyincorporated in its entirety by reference, described in relation to useon a substrate table. The control of the heat transfer element 400 maybe similar to that described in US 2011-0222033. In an embodiment theheat transfer element 400 is embedded within the thermal conditioningelement 200.

If the substrate W is rotated by the substrate position manipulator 350,a cold spot, for example, on the substrate W will be better conditionedif the heat transfer element 400 is arranged radially as illustrated inFIG. 13. The signal from the temperature sensor(s) 375 in the channel230/thermal conditioning element 200 may be used in a feedback manner tocontrol the temperature of the heat transfer element 400. For thispurpose a controller 500 may be used. In an embodiment, the top surfaceof the substrate position manipulator 350 has a heat transfer elementand a temperature sensor and the heat transfer element is controlled bythe controller 500, for example in a feedback manner based on the signalof the temperature sensor. In an embodiment, the thermal conditioningelement 200 has at least one heat transfer element 400 and no channel230.

An advantage of using a heat transfer element 400 is that a heattransfer element may respond more rapidly to a temperature change thanthe thermal conditioning system based upon flow of heat transfer fluidin the channel 230. The provision of a heat transfer element 400therefore addresses a potential disadvantage of the thermal conditioningsystem based upon flow of heat transfer fluid along a channel 230 whichis that the response time of such a system is slow as liquid which is,for example, cooled by a cold spot on the substrate W has to travel along distance along the channel 230 before it can be re-heated.

FIGS. 14 and 15 illustrate how the thickness of the thermal conditioningelement 200, and material of the thermal conditioning element 200 affectthe achievable temperature variation of a substrate W placed on thethermal conditioning element 200 in six seconds. FIG. 14 illustrates theexample for an aluminum thermal conditioning element 200 (which has athermal conductivity of 250 W/mK and a heat capacity of 2.4 Jcm⁻³ K⁻¹)whereas FIG. 15 illustrates the same results for stainless steel (whichhas a thermal conductivity of 16 W/mK and heat capacity of 3.5 Jcm⁻³K⁻¹). The x axis is an assumed heat transfer coefficient to heattransfer fluid in the channels 230 and the y axis is the total thickness205 of the thermal conditioning element 200. The lines plotted are thetemperatures of the substrates in mK from a desired temperature aftersix seconds on the thermal conditioning unit 100 with the temperatureoff-set of the substrate at zero seconds being 1000 mK. As can be seen,the FIG. 14 embodiment is significantly more effective at reducing thetemperature of the substrate towards the target temperature than thestainless steel embodiment illustrated in FIG. 15. This is a result ofthe lower heat capacity of aluminum compared to stainless steel. Clearlythe lower the thickness of the thermal conditioning element 200 and thehigher the heat transfer coefficient the faster the set pointtemperature will be reached.

FIG. 16 illustrates the results of a simulation for a thermalconditioning element 200 with a spiral channel formed in it with theheight of the channel along the x axis and the width of the channelalong the y axis. The lines with the larger numbers are the calculatedheat transfer coefficient achieved and the lines with the smallernumbers are the calculated pressure drop. For example for a pressuredrop of just over 0.5 Bar (say 0.55 Bar, by interpolation), a heattransfer coefficient of 500 W/mK may be achieved using a spiral channelof 3 mm height and 16 mm width. In an embodiment a channel of thosedimensions is used. The total thickness 205 of the thermal conditioningelement 200 is 5 mm with a top layer of 1 mm, a lower layer of 1 mm anda heat transfer component (e.g. channels 230) of 3 mm.

The results in FIG. 17 are based on an embodiment with upper and lowerlayers of aluminum of 3 mm thickness and a heat transfer component 230transferring 700 W/m²K to the substrate (the same conditions as for theFIG. 9 calculations except that the thickness of the upper and loweraluminum layers is reduced). As can be seen, although there is atemperature difference of 3 mK between the first and second substrates,the subsequent substrates all leave the thermal conditioning unit atsubstantially the same thermal off-set. Thus, FIG. 17 shows theimprovement obtainable by using a thermal conditioning element which isthinner and which is supported on a stiffening member 110 to reducemechanical deformation of the thermal conditioning element 200. Thestiffening member 110 is thermally insulated from the thermalconditioning element 200 to help ensure that the stiffening member 110does not contribute to the thermal mass of the thermal conditioningelement 200.

In an embodiment, there is provided a thermal conditioning unit tothermally condition a substrate in a lithographic apparatus, the thermalconditioning unit comprising: a thermal conditioning element comprisinga first layer, in use, facing the substrate and comprising a materialhaving a thermal conductivity of 100 W/m·K or more, a second layer and aheat transfer component positioned between the first and second layers;and a stiffening member which is stiffer than the thermal conditioningelement and configured to support the thermal conditioning element so asto reduce mechanical deformation thereof, wherein the thermalconditioning element is thermally isolated from the stiffening member.

In an embodiment, the thermal conditioning element is thermally isolatedfrom the surrounding environment. In an embodiment, the thermalconditioning element comprises a heat transfer component. In anembodiment, the heat transfer component comprises a channel for thepassage therethrough of a heat transfer fluid. In an embodiment, theheat transfer fluid is a thermally conditioned fluid. In an embodiment,the heat transfer fluid is a phase change fluid of a phase change heattransfer system. In an embodiment, the channel is part of a heat pipe.In an embodiment, the thermal conditioning unit comprises a furtherchannel, the channel and the further channel configured to be suppliedwith heat transfer fluid in parallel. In an embodiment, the first layeris made of at least one material selected from aluminum, ceramic,magnesium, SiSiC, or pyrolytic graphite. In an embodiment, the firstlayer is made of a material with a heat capacity below about 3.0Jcm⁻³K⁻¹. In an embodiment, the first layer has a thickness of 5 mm orless, 4 mm or less, 3 mm or less, 2 mm or less, 1.5 mm or less, or 1 mmor less. In an embodiment, the second layer is made of at least onematerial selected from aluminum, ceramic, magnesium, aerogel, a glassceramic, or stainless steel. In an embodiment, the second layer is madeof a material with a heat capacity of below about 3.0 Jcm⁻³K⁻¹. In anembodiment, the second layer is made of a material with a heat capacityof below about 2.0 Jcm⁻³K⁻¹ or below about 1.5 Jcm⁻³K⁻¹. In anembodiment, the second layer has a thickness of 5 mm or less, 4 mm orless, 3 mm or less, 2 mm or less, 1.5 mm or less, or 1 mm or less. In anembodiment, the first layer and second layer are made of differentmaterials. In an embodiment, the material of the first layer has a lowerheat capacity and/or a higher thermal conductivity than the material ofthe second layer. In an embodiment, the second layer is configured tosupport the thermal conditioning element on the stiffening member. In anembodiment, the thermal conditioning element comprises a projection forthe positioning thereon of the substrate. In an embodiment, the thermalconditioning element comprises a plurality of outlets and/or inletstherethrough to provide a gas flow past a portion of an underside of thesubstrate as a gas bearing so as to at least partly support thesubstrate on the thermal conditioning element. In an embodiment, thethermal conditioning unit further comprises a substrate positionmanipulator configured to alter the relative position and/or orientationof the substrate to the thermal conditioning element. In an embodiment,a part of the substrate positioning manipulator extends through thethermal conditioning element. In an embodiment, the thermal conditioningunit further comprises a support structure to support the thermalconditioning element on the stiffening member and which contacts thethermal conditioning element at a plurality of discrete locations. In anembodiment, at least one of the plurality of discrete locations isdistant from an edge of the thermal conditioning element. In anembodiment, the thermal conditioning unit comprises a plurality of leafsprings to support the thermal conditioning element on the stiffeningmember. In an embodiment, the thermal conditioning unit furthercomprises a gas bearing configured to support the thermal conditioningelement on the stiffening member. In an embodiment, the thermalconditioning unit further comprises a heater associated with the thermalconditioning element. In an embodiment, the heater is a thin filmheater. In an embodiment, the thin film heater is on an outer surface ofthe thermally conditioning element facing the substrate.

In an embodiment, there is provided a lithographic apparatus comprisingthe thermal conditioning unit as described herein.

In an embodiment, there is provided a device manufacturing method usinga lithographic apparatus, the method comprising: thermally conditioninga substrate by placing it over a thermal conditioning element comprisinga first layer, facing the substrate, comprising a material having athermal conductivity of 100 W/m·K or more, a second layer and a heattransfer component positioned between the first and second layers, thethermal conditioning element being supported by a stiffening member toreduce mechanical deformation of the thermal conditioning element; andprojecting a patterned beam onto the substrate, wherein the thermalconditioning element is thermally isolated from the stiffening member.

As will be appreciated, any of the above described features can be usedwith any other feature and it is not only those combinations explicitlydescribed which are covered in this application.

Although specific reference may be made in this text to the use oflithographic apparatus in the manufacture of ICs, it should beunderstood that the lithographic apparatus described herein may haveother applications in manufacturing components with microscale, or evennanoscale features, such as the manufacture of integrated opticalsystems, guidance and detection patterns for magnetic domain memories,flat-panel displays, liquid-crystal displays (LCDs), thin-film magneticheads, etc. The skilled artisan will appreciate that, in the context ofsuch alternative applications, any use of the terms “wafer” or “die”herein may be considered as synonymous with the more general terms“substrate” or “target portion”, respectively. The substrate referred toherein may be processed, before or after exposure, in for example atrack (a tool that typically applies a layer of resist to a substrateand develops the exposed resist), a metrology tool and/or an inspectiontool. Where applicable, the disclosure herein may be applied to such andother substrate processing tools. Further, the substrate may beprocessed more than once, for example in order to create a multi-layerIC, so that the term substrate used herein may also refer to a substratethat already contains multiple processed layers.

The terms “radiation” and “beam” used herein encompass all types ofelectromagnetic radiation, including ultraviolet (UV) radiation (e.g.having a wavelength of or about 365, 248, 193, 157 or 126 nm).

The term “lens”, where the context allows, may refer to any one orcombination of various types of optical components, including refractiveand reflective optical components.

While specific embodiments of the invention have been described above,it will be appreciated that the invention, at least in the form of amethod of operation of an apparatus as herein described, may bepracticed otherwise than as described. For example, the embodiments ofthe invention, at least in the form of a method of operation of anapparatus, may take the form of one or more computer programs containingone or more sequences of machine-readable instructions describing amethod of operating an apparatus as discussed above, or a data storagemedium (e.g. semiconductor memory, magnetic or optical disk) having sucha computer program stored therein. Further, the machine readableinstruction may be embodied in two or more computer programs. The two ormore computer programs may be stored on one or more different memoriesand/or data storage media.

Any controllers described herein may each or in combination be operablewhen the one or more computer programs are read by one or more computerprocessors located within at least one component of the lithographicapparatus. The controllers may each or in combination have any suitableconfiguration for receiving, processing and sending signals. One or moremultiple processors are configured to communicate with at least one ofthe controllers. For example, each controller may include one or moreprocessors for executing the computer programs that includemachine-readable instructions for the methods of operating an apparatusas described above. The controllers may include data storage media forstoring such computer programs, and/or hardware to receive such media.So the controller(s) may operate according to the machine readableinstructions of one or more computer programs.

An embodiment of the invention may be applied to substrates with a width(e.g., diameter) of 300 mm or 450 mm or any other size.

One or more embodiments of the invention may be applied to any immersionlithography apparatus, in particular, but not exclusively, those typesmentioned above, whether the immersion liquid is provided in the form ofa bath, only on a localized surface area of the substrate, or isunconfined on the substrate and/or substrate table. In an unconfinedarrangement, the immersion liquid may flow over the surface of thesubstrate and/or substrate table so that substantially the entireuncovered surface of the substrate table and/or substrate is wetted. Insuch an unconfined immersion system, the liquid supply system may notconfine the immersion liquid or it may provide a proportion of immersionliquid confinement, but not substantially complete confinement of theimmersion liquid.

A liquid supply system as contemplated herein should be broadlyconstrued. In certain embodiments, it may be a mechanism or combinationof structures that provides a liquid to a space between the projectionsystem and the substrate and/or substrate table. It may comprise acombination of one or more structures, one or more liquid inlets, one ormore gas inlets, one or more gas outlets, and/or one or more liquidoutlets that provide liquid to the space. In an embodiment, a surface ofthe space may be a portion of the substrate and/or substrate table, or asurface of the space may completely cover a surface of the substrateand/or substrate table, or the space may envelop the substrate and/orsubstrate table. The liquid supply system may optionally further includeone or more elements to control the position, quantity, quality, shape,flow rate or any other features of the liquid.

The descriptions above are intended to be illustrative, not limiting.Thus, it will be apparent to one skilled in the art that modificationsmay be made to the invention as described without departing from thescope of the claims set out below.

1. A thermal conditioning unit to thermally condition a substrate, thethermal conditioning unit comprising: a thermal conditioning elementcomprising a first layer, in use, facing the substrate and comprising amaterial having a thermal conductivity of 100 W/m·K or more, a secondlayer and a heat transfer component positioned between the first andsecond layers; and a stiffening member which is stiffer than the thermalconditioning element and configured to support the thermal conditioningelement so as to reduce mechanical deformation thereof, the stiffeningmember arranged such that the second layer is positioned between theheat transfer component and the stiffening member, wherein the thermalconditioning element is supported on the stiffening member in anon-contacting manner. 2.-3. (canceled)
 4. The thermal conditioning unitof claim 1, wherein the heat transfer component comprises a channel forthe passage therethrough of a heat transfer fluid.
 5. (canceled)
 6. Thethermal conditioning unit of claim 4, wherein the heat transfer fluid isa phase change fluid of a phase change heat transfer system. 7.(canceled)
 8. The thermal conditioning unit of claim 4, wherein thethermal conditioning unit comprises a further channel, the channel andthe further channel configured to be supplied with heat transfer fluidin parallel.
 9. (canceled)
 10. The thermal conditioning unit of claim 1,wherein the first layer and/or the second layer is made of a materialwith a heat capacity below about 3.0 Jcm⁻³K⁻¹.
 11. The thermalconditioning unit of claim 1, wherein the first layer has a thickness of5 mm or less. 12.-14. (canceled)
 15. The thermal conditioning unit ofclaim 1, wherein the second layer has a thickness of 5 mm or less. 16.The thermal conditioning unit of claim 1, wherein the first layer andsecond layer are made of different materials.
 17. The thermalconditioning unit of claim 1, wherein the material of the first layerhas a lower heat capacity and/or a higher thermal conductivity than thematerial of the second layer. 18.-19. (canceled)
 20. The thermalconditioning unit of claim 1, wherein the thermal conditioning elementcomprises a plurality of outlets and/or inlets therethrough to provide agas flow past a portion of an underside of the substrate as a gasbearing so as to at least partly support the substrate on the thermalconditioning element.
 21. The thermal conditioning unit of claim 1,further comprising a substrate position manipulator configured to alterthe relative position and/or orientation of the substrate to the thermalconditioning element. 22.-25. (canceled)
 26. The thermal conditioningunit of claim 1, further comprising a gas bearing configured to supportthe thermal conditioning element on the stiffening member.
 27. Thethermal conditioning unit of claim 1, further comprising a heaterassociated with the thermal conditioning element.
 28. (canceled)
 29. Alithographic apparatus comprising: a pattern transfer system configuredto transfer a pattern onto a substrate; a thermal conditioning unit tothermally condition the substrate, the thermal conditioning unitcomprising: a thermal conditioning element comprising a first layer, inuse, facing the substrate and comprising a material having a thermalconductivity of 100 W/m·K or more, a second layer and a heat transfercomponent positioned between the first and second layers; and astiffening member which is stiffer than the thermal conditioning elementand configured to support the thermal conditioning element so as toreduce mechanical deformation thereof, the stiffening member arrangedsuch that the second layer is positioned between the heat transfercomponent and the stiffening member, wherein the thermal conditioningelement is supported on the stiffening member in a non-contactingmanner.
 30. A device manufacturing method using a lithographicapparatus, the method comprising: thermally conditioning a substrate byplacing it over a thermal conditioning element comprising a first layer,facing the substrate, comprising a material having a thermalconductivity of 100 W/m·K or more, a second layer and a heat transfercomponent positioned between the first and second layers, the thermalconditioning element being supported by a stiffening member to reducemechanical deformation of the thermal conditioning element and thestiffening member arranged such that the second layer is positionedbetween the heat transfer component and the stiffening member; andprojecting a patterned beam onto the substrate, wherein the thermalconditioning element is supported on the stiffening member in anon-contacting manner.
 31. The thermal conditioning unit of claim 1,further comprising a plurality of projections configured to support thesubstrate on its underside at a plurality of locations.
 32. The thermalconditioning unit of claim 31, wherein an under pressure is providedbetween the plurality of projections, the thermal conditioning elementand the substrate.
 33. The thermal conditioning unit of claim 31,wherein a gas is provided to a region between the substrate and thethermal conditioning element, and the gas has a thermal conductivitygreater than or equal to 100 mW/m·K at 298K.
 34. The thermalconditioning unit of claim 1, further comprising a temperature sensorprovided in the thermal conditioning element, wherein a signal from thetemperature sensor is used to control the temperature of the thermalconditioning element.
 35. The thermal conditioning unit of claim 1,wherein the heat transfer component has a ring shape.